Intel promotes USB 3.0 (By Intel)
Industry Leaders Develop Superspeed USB Interconnect
Popular USB Computer Connection Technology Expands performance with Proposed USB 3.0 Specification
INTEL DEVELOPER FORUM, San Francisco, Sept. 18, 2007 – Intel Corporation and other industry leaders have formed the USB 3.0 Promoter Group to create a superspeed personal USB interconnect that can deliver over 10 times the speed of today's connection. The technology, also developed by HP, Microsoft Corporation, NEC Corporation, NXP Semiconductors and Texas Instruments Incorporated, will target fast sync-and-go transfer applications in the PC, consumer and mobile segments that are necessary as digital media become ubiquitous and file sizes increase up to and beyond 25 Gigabytes.
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Source: Intel Press Release
Popular USB Computer Connection Technology Expands performance with Proposed USB 3.0 Specification
INTEL DEVELOPER FORUM, San Francisco, Sept. 18, 2007 – Intel Corporation and other industry leaders have formed the USB 3.0 Promoter Group to create a superspeed personal USB interconnect that can deliver over 10 times the speed of today's connection. The technology, also developed by HP, Microsoft Corporation, NEC Corporation, NXP Semiconductors and Texas Instruments Incorporated, will target fast sync-and-go transfer applications in the PC, consumer and mobile segments that are necessary as digital media become ubiquitous and file sizes increase up to and beyond 25 Gigabytes.
... Read More
Source: Intel Press Release
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